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Acronyms

4000/B series : Series name for RCA Logic circuits

AME: Advanced Microcircuit Emulation

ASICs: Application Specific Integrated Circuits

ATE: Automatic Test Equiptment

BiCMOS: Bipolar CMOS

CAGE Code: Commercial and Government Entity Code

CMOS: Complementary metal-oxide semiconductor

DFT: Design-for-test

DLA: Defense Logistics Agency

DMS:Diminishing Manufacturing Sources

DMSMS: Diminishing Manufacturing Sources and Material Shortages

DRAM: Dynamic random-access memory

DRC: Design Rule Checking

DTI Schottky: Deep Trench Isolation Schottky

DTL: Diode-Transistor Logic

DUT: Device under Test

ECL: Emitter Coupled Logic

EM: Electromigration

FAST: Fairchild Advanced Schottky TTL

FCT: Fast CMOS TTL Compatible Logic

FPGA: Field-programmable gate array

GEM: Generalized Emulation of Microcircuits

HCI: Hot Carrier Injection

HDL: Hardware Description Language

HVCMOS: High Voltage CMOS

HiNIL: High-Noise-Immunity Logic

ISO: International Organization for Standardization

LVS: Layout Versus Scematic

MESA WIP:

MICAP: Mission Impaired Capability Awaiting Parts

NIIN: National Item Identification Number

MIL-PRF-38535: DLA’s integrated circuit specification document

MOS: Metal-Oxide-Semiconductor

NMOS: N-type Metal-Oxide-Semiconductor

NSN: National/NATO Stock Number

PAL: Programmable Array Logic

PIN: Part Identification Number

PIIN:

QML: Qualified Manufacturer List

RE: Reverse Engineering

RCA: Radio Corporation of America

ROM: Read Only Memory

RTL:

SIA: Semiconductor Industry Association

SMD: Standard Military Drawing

SOI: Silicon on insulator

SRAM: Static Random Access Memory

TAPO: DoD Trusted Access Program Office

TCAD: Technology Computer Aided Design

TDP: Technical Data Package

TTL: Transistor–transistor Logic

UHD: Series name for a Power & Relay Drivers

VHDL: VHSIC Hardware Description Language

VHSIC: Very High Speed Integrated Circuit

WAT: Wafer Acceptance Testing

WLR: Wafer Level Reliability