Trusted Wafer Foundry
For over 40 years, SRI's on-site wafer foundry has offered silicon processing for a diverse array of technologies. SRI’s Microcircuit Emulation Wafer Fab occupies approximately 25,000 square feet at the Princeton campus. The foundry is Trusted and QML certified. The Wafer Fab has ISO 4 (Class 10) and ISO 5 (Class 100) cleanrooms. The facility uses the MESA WIP tracking system which enables real time wafer lot tracking and history. Statistical Process Control is implemented in all key process areas and out of control action plans are followed as required. Full documented procedures and training records are the basis of audited certifications for all staff. SRI maintains all process equipment with vendor trained staff and service contracts where appropriate.
In-house process capabilities include advanced and automated process equipment supporting diffusion, deposition, photolithography, etch, ion implantation and Rapid Thermal Processing (RTP).
The Wafer Fab is configured to process six-inch silicon and silicon-on-insulator (SOI) substrates. Process technologies range within the 3.0 to 0.35 µm technology node. Technologies include BICMOS, CMOS and Bipolar.
In 2007 the DoD Trusted Access Program Office (TAPO) accredited SRI's wafer foundry as a Department of Defense (DoD) Category 1 Trusted Foundry. With this endorsement, SRI is able to offer the DoD and Government agencies a secure on-shore, QML-certified wafer foundry for military electronics. Additionally, the wafer foundry enables technical and commercial self-sufficiency, with capabilities from design to manufacturing that can all be performed in-house.